Product Detail
Back-grind UV Tape
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Back-grind UV Tape
Detail

OurTape has been the world top BG(Back grinding) tape for many decades. Now, our tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow.

The non-UV tape conventional type of the ICROS™ backgrinding wafer tape line features little to no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.

The UV tape of the ICROS™ backgrinding wafer tape line features high adhesive strength, no contamination transferred to the wafer surface, outstanding topography absorption, prevents water penetration and wafer breakage, and superior TTV.


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