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Advanced PKG Equipments – bumping/Fan In/Out Related
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Advanced PKG Equipments – bumping/Fan In/Out Related
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Wafer bonding refers to attaching two or more substrates or wafers, of materials such as glass or silicon, to each other by means of various chemical and physical effects. Wafer bonding is mainly used in MEMS, where sensor components are encapsulated in the application. Other markets for this technology include advanced packaging, 3D integrationand CIS manufacturing. Temporary wafer bonding is a specialized technology within wafer bonding that is regarded as a key technology for 3D integratio


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